Batch-type plasma ashing processing device (batch-type plasma asher)
Batch-type plasma ashing device for 50 wafers at once.
This device is a batch-type plasma ashing system with a coaxial barrel structure in the chamber, capable of processing 50 wafers at once. It supports wafer sizes of 5 inches or smaller, as well as 6 inches and 8 inches. Additionally, it can optionally accommodate both 4-inch and 6-inch wafers, as well as 5-inch and 6-inch wafers. The high-frequency plasma excitation can be used for various process applications, such as low-damage ashing (ash removal) and surface modification, on photoresist thin films formed on silicon wafers.
- Company：リバティー
- Price：Other
